new product cu foam copper plate heat dissipation material

new product cu foam copper plate heat dissipation material

Cu Foam + Copper Plate, Heat Exchanger, Heat Sink, New …Cu Foam + copper plate,heat exchanger,heat sink,new product Cu Foam + copper plate Heat transfer coefficient:>6w/(m2k) Mechanical strength:≥2.5MPa Tensile strength:5-18KPa Pore size:0.1-10mm Porosity:60-98% Through-hole rate:≥98 Volume density:>0.15/cm3 PPi(number of pore per inch):5-130 A...

(2) Rockville W12K9D2 12" 8000 Watt Car

The 100% copper stranded wire is extremely tolerant of the hostile conditions found under the hood in vehicles and compensates for vibration, heat expansion and flexibility. This flexible and well shielded wire is crucial for getting through all of the nooks and passageways within the confines of a vehicle interior. (PDF) Copper metal foam as an essential construction new product cu foam copper plate heat dissipation materialA copper (Cu) foam was brazed with Cu-4.0Sn-9.9Ni-7.8P filler foil for joint strength and interface analysis. Brazed 50 pores per inch (PPI) Cu foam yielded a maximum compressive strength of 14.4 new product cu foam copper plate heat dissipation material

(PDF) Experimental Studies on a Flat Plate Heat Pipe for new product cu foam copper plate heat dissipation material

Micro and miniature heat pipes Electronic component coolers By Leonard L Vasiliev Design, fabrication and performance evaluation of axially grooved wick assisted heat pipe (PDF) Fabrication of Metal Matrix Composites by Powder new product cu foam copper plate heat dissipation materialIn situ synthesis if TiC Nano particles from precursors of Nano diamond inside an aluminium or copper matrix. Initial materials are Al or Cu powders as matrix materials and titanium and Nano diamond powders as the precursors for TiC synthesis. Mechanical milling is the process of preparing the Nano composite granules. 12" Archives - Sound AroundThe P2D4-12 sub works equally well in a sealed or ported enclosure, so you can choose the kind of bass you want for your system. To drive this single subwoofer, we recommend a mono amplifier rated between 300 and 600 watts RMS at 2 ohms. Product Highlights 12 subwoofer with dual 4-ohm voice coils.

1pcs Carbon Foam Plate Sheet Size 100 x 100mm Thickness

After being graphitized, the thermal conductivity of the foam carbon is very high in the range of 50~200W/M. Carbon foam has been developed for decades. Due to its low density and high thermal conductivity, it has been widely used in many fields. A review of shape memory material's applications in the new product cu foam copper plate heat dissipation materialThe sealing plates keep the fluid contained within the SMP and prevent its exposure to other wellbore locations as the device is being transported downhole. Once the device reaches the desired location, the SMP foam is actuated by heating, causing the SMP foam to regain its original shape and thus release the fluid (shown in figure 21(c)). Additively Manufactured Copper Components and suitable for copper materials . With the high thermal conductivity of Cu and Cu alloys, their inability to absorb the laser light, and their high heat dissipation, it was not yet possible to apply SLM to these materials. The SLM modifications included using a uniform beam profile laser with

Advanced Materials and Process Technology

Volume is indexed by Thom Reuters CPCI-S (WoS). The studies presented in this book cover the topics of composites, micro/nano-materials and equipment, alloy materials, steel, Buy 1pc 99.9% Copper Sheet Plate DIY Handmade Material new product cu foam copper plate heat dissipation material(SPECIAL PROMO) US $6.30 20% OFF Buy 1pc 99.9% Copper Sheet Plate DIY Handmade Material Pure Copper Tablets DIY Material For Industry Mould Or Metal Art 100x100mm From Merchant Linging Store. Enjoy Free Shipping Worldwide! Limited Time Sale Easy Return. Shop Quality Best Tool Parts Directly From China Tool Parts Suppliers. COPPER FOAM VIM Technology

CPU Fans and Heatsinks Newegg

Cooler Master Hyper 212 RGB Black Edition CPU Air Cooler, SF120R RGB Fan, 4 CD 2.0 Heatpipes, Anodized Gun-Metal Black, Brushed Nickel Fins, RGB Lighting for AMD Ryzen/Intel LGA1200/1151. Series Hyper 212 RGB Black Edition. Type Fan Heatsinks. RPM 650 - 2,000 RPM (PWM) +/- 10%. Carbon Fiber Sheets - Thomasnet&- Product Sourcing and new product cu foam copper plate heat dissipation materialCarbon fiber sheets are available in 59 in. x 63 in. size and thicknesses ranging from 1/64 in. to 1/8 in. with temperature ratings from -40 degrees F to +840 degrees F and maximum pressure ratings up to 1900 psi. Carbon fiber sheets can be used with service media such as saturated steam, water, brine, mild acids, alkalis, air, oils, solvents new product cu foam copper plate heat dissipation material Cheap Copper For Sale - 2021 Best Copper Deals Buy cheap copper online. Want cheap copper? We have 2021 new copper products on sale. Prices may vary so we advise you do a search for Copper Aluminum Price, Copper Casting Price, Iron And Copper Price for compari shopping before you place an order, then you can get high quality low price Copper Aluminum, Copper Casting, Iron And Copper products here.

China Cathode Copper, Cathode Copper Manufacturers new product cu foam copper plate heat dissipation material

The Cathode Copper and Electrolytic Copper Powder, Copper Cathode Sheet, Electrolytic Copper Cathode products are usually used to get more enegy for specific effects. For example, soil and water can grow food, wood can be burned to provide heat or to build shelters. China Heat Exchangers, Cu Foam + Copper Plate, Heat Sink new product cu foam copper plate heat dissipation materialCu Foam + copper plate,heat exchanger,heat sink,new product Our copper foam heat exchangers are used when traditional methods of thermal stabilization are inadequate. They are custom built and provide more than double the cooling effectiveness of a traditional fin heat exchanger. Cu Foam + copper plate Heat transfer coefficient:>6w/(m2k) China High Quality Stud Nut Electrode - China Electrode new product cu foam copper plate heat dissipation materialHigh quality stud Nut Electrode Due to its high melting point, tungsten ensures that even the high temperatures that occur at the particularly exposed tip cause no damage to the spray nozzle. The high level of thermal conductivity provided by tungsten and copper ensure optimum heat dissipation. As a result, our nozzles and electrodes offer excellent resistance to arc erosion.

China Nickel-Plated Aluminum Plate/Copper-Plated

Last Login Date Oct 13, 2021 Business Type Manufacturer/Factory, Group Corporation Main Products Nickel-Plated Aluminum Strip, Copper-Plated Aluminum Foil, Gold-Plated Aluminum Strip, Tinned Aluminum Strip, Silver-Plated Aluminum Strip, Roll-to-Roll Anodizing, Roll-to-Roll Micro-Arc Oxidation, Roll-to-Roll Electrophoresis, Roll-to-Roll Electro-Sink Coating, Roll to Roll Aluminum Strip Plating China Tungsten-Copper Plasma Spray Electrodes and Tungsten-copper plasma spray electrodes and nozzles Due to its high melting point, tungsten ensures that even the high temperatures that occur at the particularly exposed tip cause no damage to the spray nozzle. The high level of thermal conductivity provided by Cisco UCS 5108 Server Chassis Installation Guide new product cu foam copper plate heat dissipation materialThe Cisco R Series Racks are an ideal choice. If other racks will be used, the rack must be of the following type Standard 19-inch (48.3 cm) four-post EIA rack, a minimum of 39.4 inches (100 cm) deep, with mounting rails that conform to English universal hole

Copper Foam (Cu Foam) Supplier Stanford Advanced

Copper Foam Description . Copper Foam (Cu Foam) of high quality are available at Stanford Advanced Materials (SAM).Copper Foam is a new multifunctional material with a large number of connected or unconnected holes uniformly distributed in the copper matrix.Copper Foam has good conductivity and ductility, and its preparation cost is lower than that of foamed nickel, and its conductivity is better. Copper We Buy Copper Scrap and 1909 other B2B productsRed copper foil, also known as pure copper foil, is a high-purity copper foil product with good conductivity and heat dissipation new product cu foam copper plate heat dissipation material. Dongguan Yinghong Technology Co., Ltd Made in China Dayton Audio UM12-22 12" Ultimax DVC Subwoofer 2 ohms Dayton Audio UM12-22 12" Ultimax DVC Subwoofer 2 ohms Per CoilIf you want outrageous amounts of bass, you gotta move some airThe Ultimax Series of dual voice coil subwoofers, from Dayton Audio, are not for the faint of heart. Built using the latest in subwoofer technology, Ultimax subwoofers are the pinnacle of low frequency driver design. An Ultimax subwoofer tests the strength of your new product cu foam copper plate heat dissipation material

Design and CFD Analysis of Micro-Fin Heat Sink IJERT

A heat sink is usually made out of copper or aluminium. Copper is used because it has many desirable properties for thermally efficient and durable heat exchangers. First and foremost, copper is an excellent conductor of heat. This means that copper's high thermal conductivity allows heat to pass through it quickly. Dewhel JDM Front Bumper Tow Hook License Plate Mount new product cu foam copper plate heat dissipation materialLED Headlight Bulbs Conversion Kit - 4WDKING H11/H8/H9 Copper Braid Fanless Heat Dissipation Super Bright Low Beam Fog Light 60W 8000LM 6500K Cool White High Beam with T10 x2 Dissimilar Materials BondingIn order to improve the heat dissipation capacity of graphite based materials, Applied Nanotech developed a new passive thermal management material, CarbAl, which is a carbon-based material with a unique combination of low density, high thermal diffusivity, and low coefficient of thermal expansion based on Figure 1. Figure 1.

Emissivity Coefficient Materials

The emissivity coefficient US$ 10,00-US$ 50,00 / stuk FAQ Horae New MaterialBase Material; The function of the base material is to hold the adhesive and primer. It is relatively thin and very smooth. There are many types of base materials, such as PET, PI, PVC, Nomex paper, glass fiber, foam, non-woven fabric, Teflon, metal foil, etc. Different base materials are selected according to the place, how long and specific use of the tape. FS 48-Port Gigabit Ethernet L2+ Fully Managed Switch - FSFS 48-Port Gigabit Ethernet L2+ Fully Managed Switch S3900-48T4S features 4 10Gb SFP+ uplinks and supports up to 6 units stacking and LACP, which is an ideal Gigabit access switch for SMB, enterprise, and campus networks.

FUJI CHEMI TRADING CO., LTD. - Products

Film Products Film Products. From general-purpose plastic film to functional film that has been given some function by surface treatment such as coating or vapor deposition on the base material, secondary processing such as laminating, or adding additives to the plastic resin that Fillers. - Free Online LibraryProducts are cost-effective, functional fillers and reinforcements for improving mechanical and physical properties in thermoset, thermoplastic and elastomeric applications. New generation of fine-diameter, high-aspect ratio grades. exhibit superior balance in flex, impact and melt flow at a reduction in raw material/unit costs. Foam Copper, Copper Foam Super Capacitor-Specific Cu (1). Electrode materials. The excellent conductivity of foam copper can be widely applied to the electrode framework materials of new batteries such as nickel zinc battery and double layer capacitor. At present, foam copper has been tried by many nickel zinc battery manufacturers and put into mass use.

Foundation Cooling Hackaday

The equilibrium temp will be low because you are spreading 150W heat over what has to be around 4 liters of water and 6m of copper pipe, that is a lot to dissipate heat. The transfer from new product cu foam copper plate heat dissipation material Green chemistry and nanofabrication in a levitated new product cu foam copper plate heat dissipation materialFigure 5eg shows the sequence of heating where one can see that the neat foam melted, while the hybrid one maintained its shape due to its HEAT TRANSFER HW2 SOLUTION Problem 3.5 in the HEAT TRANSFER HW2 SOLUTION 1. (Problem 3.5 in the Book) A dormitory at a large university, built 50 years ago, has exterior walls constructed of L s = 300-mm-thick sheathing with a thermal conductivity of k s = 0.1 W/m K. To reduce heat losses in the winter, the university decides to

Heat Exchanger, Heat Sink, Cu Foam + Copper Plate, New new product cu foam copper plate heat dissipation material

Cu Foam + copper plate,heat exchanger,heat sink,new product Cu Foam + copper plate Heat transfer coefficient:>6w/(m2k) Mechanical strength:2.5MPa Tensile strength:5-18KPa Pore size:0.1-10mm Porosity:60-98% Through-hole rate:98 Volume density:>0.15/cm3 PPi(number of Heat-Conducting Carbon Foam - SlashdotVery pricey to produce but has 4-5 times the efficiency of copper at 1/5th the weight of aluminum. Copper is a better conductor of heat than aluminium. 'nuff said. The article states the foam is 4-5 times better than copper, and 3 1/2 times better than aluminum at conducting heat. Yet another worthless piece of reporting. Heatsink Copper Views 11939 Published 23.5.2021 Author aps.brescia.it Copper Heatsink . About Copper Heatsink

Heatsink Copper

Views 22137 Published 16.4.2021 Author finestre.napoli.it Heatsink Copper . About Copper Heatsink High Performance Heat Storage and Dissipation TechnologyThe system study assumed that besides the host structure (i.e., heat pipe and container), paraffin wax (Calwax 130) is contained in an aluminum (Al) foam of 20vol.% and the metal hydride was mixed with Copper (Cu) and Tin (Sn) of 17vol.% for thermal conductivity enhancement. International Journal of Minerals, Metallurgy and MaterialsInternational Journal of Minerals, Metallurgy and Materials (IJMMM, ISSN 1674-4799, CN 11-5787/TF, monthly, started in 1994, formerly known as Journal of University of Science and Technology Beijing) is an international journal devoted to publishing original research articles (and occasional invited reviews) on all aspects of minerals processing, physical metallurgy, process metallurgy, and new product cu foam copper plate heat dissipation material

Low Heat-China Low Heat Manufacturers Suppliers

China Low Heat - Select 2021 Low Heat products from verified China Low Heat manufacturers, suppliers on . Low Thermal Expansion Material Products Suppliers new product cu foam copper plate heat dissipation materialDescription material. Composite heat-sinks made of molybdenum/copper (Mo/Cu) or copper tungsten (Cu/W) are then integrated into strategic locations of the structure. This combination of titanium and Mo/Cu or Cu/W is ideal for achieving lightweight, low-coefficient of thermal. Materials Other Metal Mold Casting Products Suppliers Engineering360Description Impro is capable of meeting material specifications according to ASTM, SAE, AISI, ACI, DIN, EN, ISO, and GB standards. We pour investment castings of more than 100 different ferrous and non-ferrous alloys. We have both green sand and resin sand casting processes for iron sand . Casting Type Centrifugal Casting, Investment Casting, Permanent Mold Casting, Sand Casting

PCB Etch, PCB Echant, Printed Circuit Board fabrication

Fe FeCl3 CuCl2 Cu is -0.78 V, with the driving EMF cathode at the Fe electrode and the anode connected to the Cu electrode. Unfortunately, it takes a lot of current to plate out the copper. A double-sided, 12-sq. board at 1 oz/sq.ft./side contains 4.7 g Cu. Therefore it takes 2.4 amp-hrs of current to plate it out! Pollution Prevention in the Plating ProcessMetal Finishing Industry. Table of Contents Regulatory Planning P2 Programs Common P2 Practices Pre-Finishing Operations P2 in Plating P2 in Rinsing Alternative Methods of Metal Deposition Facility Design. Pollution Prevention in the Plating Process. This chapter provides an overview of pollution prevention techniques that apply to plating lines within metal finishing operations. Pool boiling heat transfer of HFE-7100 on metal foams new product cu foam copper plate heat dissipation materialFor moderated heat fluxes (120 kW/m 2), the HTC enhancement becomes evident by a decrease in the wall superheating of 11.4 K for Cu foam and 12.1 K for Ni foam, as compared to the plain surface for a similar heat flux. This result implies a HTC augmentation of 100% and 82% promoted by the Cu and Ni foams, respectively.

Principles of Metal Foam-Based Cooling Systems - QA new product cu foam copper plate heat dissipation material

A It depends on the base material. For carbon and ceramic foams, 100 Pores Per Inch (PPI) are readily achievable. The most common pore sizes for aluminum and copper are 5, 10, 20, and 40 PPI, and porosity (i.e. 1-relative density) for uncompressed metal foam ranges from 0.85-0.97 (3% PrometheusCU Overclock.netIt looks to me that the new macbooks and the slim bluetooth keyboard use the same keys at least I hope so because new replacement keys were about $2.50 a piece, so I ordered a complete set of black keys for the keyboard. I'll then make new copper housing for Rockville DV12K52 Dual 12" K5 2800w Car Enclosure air space is 1.82 Cu Ft per sub; Vent dimensions 3" x 9.75" x 9.75" Tuning frequency of enclosure 35 Hz; 2" 4-Layer Black Aluminum Voice Coils Wound with OFC (100% Copper) Wire; The wire we use to wind the voice coil is imported from Japan which is way better quality than the standard China wire; 50 Oz High Quality Magnet

Rockville W15K6D2 V2 15" 4000w Car Audio new product cu foam copper plate heat dissipation material

About this item Package Includes (1)Rockville 15" Car Audio Subwoofer. (1)Rockville Single 15" Vented Car Sub Enclosure Box 3.51 Cu Ft, 3/4" MDF. 10 Drywall Wood Screws (Wood screws are the type of screws; the screws are actually made of metal). 12 Feet of 14 AWG Blue Speaker Wire. 2 Ta1 Titanium Fiber Felt, High Porosity Ti Fiber Products new product cu foam copper plate heat dissipation materialChina Ta1 Titanium Fiber Felt, High Porosity Ti Fiber Products Titanium Fiber Felt for Battery Research, Find details about China Titanium Fiber Felt, Titanium Felt from Ta1 Titanium Fiber Felt, High Porosity Ti Fiber Products Titanium Fiber Felt for Battery Research - Xiamen Tmax Battery Equipments Limited Tape Tapes, Adhesives, Materials DigiKeyINFORMATION About Digi-Key Marketplace Sell on Digikey Careers Site Map API Solutions Newsroom. HELP Help and Support Order Status Shipping Rates/Options Returns and Order Issues Tariff Information. CONTACT US 1-800-344-4539 218-681-6674 [email protected] 218-681-3380 800-344-4539. FOLLOW US.

Temperature Change and Heat Capacity Physics

Heat Transfer and Temperature Change. The quantitative relationship between heat transfer and temperature change contains all three factors Q = mcT, where Q is the symbol for heat transfer, m is the mass of the substance, and T is the change in temperature. The symbol c stands for specific heat and depends on the material and phase. The specific heat is the amount of heat necessary to new product cu foam copper plate heat dissipation material Thermal Conductivity of Metals, Metallic Elements and AlloysThermal Conductivity - k - is the quantity of heat transmitted due to an unit temperature gradient, in unit time under steady conditions in a direction normal to a surface of the unit area. Thermal Conductivity - k - is used in the Fourier's equation. Calculate Conductive Heat Transfer ; Thermal ManagementIn order to improve the heat dissipation capacity of graphite based materials, Applied Nanotech developed a new passive thermal management material, CarbAl, which is a carbon-based material with a unique combination of low density, high thermal diffusivity, and low coefficient of thermal expansion based on Figure 1. Figure 1.

Three Applications amp; Matters Needing Attention of PTC new product cu foam copper plate heat dissipation material

The distance between the heated solid and the PTC heater should be within 30mm when the material with high thermal conductivity (such as aluminum, copper, graphite) conducts heat UL Thermal Conductive Pad 3W/M-K For Automotive Engine new product cu foam copper plate heat dissipation materialThe TIF140-30-50S thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components. US Patent Application for METAL FOAMS Patent Application new product cu foam copper plate heat dissipation materialThe uncoated or raw open cell porous structure (the substrate) can be made of a great variety of materials e.g. selected from one or more of a metal or metal alloys; a metal (e.g. aluminium) or metal alloy (e.g. AlSi7Mg0.3) foam; The material of the substrate foam could also consist of a metal oxide, carbide and/or nitride, carbon, an organic new product cu foam copper plate heat dissipation material

US20020108743A1 - Porous media heat sink apparatus new product cu foam copper plate heat dissipation material

A porous media heat sink usable as a small heat exchange device to air-cool a high power dissipation rate object in a low-noise environment. The heat sink comprises a thermally conductive base, a plurality of thermally conducting fins coupled to the base and oriented substantially normal or perpendicular to the base, and a plurality of thermally conductive porous media elements interleaved new product cu foam copper plate heat dissipation material Ultraic spot welding of aluminum to copper a review new product cu foam copper plate heat dissipation materialAluminum (Al) and copper (Cu), possessing high electrical and thermal conductivity coupled with prominent anti-corrosion and mechanical properties, are usually employed for battery tab and bus bar .Unfortunately, joining dissimilar materials of Al to Cu utilizing conventional fusion welding technique has a great challenge because of their obvious differences in physical and new product cu foam copper plate heat dissipation material Uxcell a12110900ux0388 Aluminum Heat Sink for Solid TIHOOD 3PCS Aluminum Heat Sink SSR Dissipation for Single Phase Solid State Relay 10A-40A Black uxcell K Type 5cm Long Probe Thermocouple Sensor or Temperature Controller 3D Printer Silicone Heated Pad, Heating Plate 310x310mmx1.5mm, 120V 750W for Creality CR-10 /CR-10S 3D Printers Heater Bed with Screw Holes /3M Adhesive

What is New in Packaging @ Georgia Tech? New

Zero-resistance TIM Thermal dissipation requirements of 30-100W power amplifiers was addressed by integrating large copper heat spreaders directly and conformally onto the Si ICs, as shown in Fig. 3. By reducing the number of interfaces between the heat source and heat sink, heat transfer has been maximized. ZALMAN CNPS8900 Quiet 110mm PWM Fan Long Life The slim ZALMAN CNPS8900 Quiet offers ultra-quiet cooling for low profile cases. An ultra quiet 110mm PWM fan, two Direct Touch heatpipes and aluminum fins combine to deliver efficient heat dissipation to keep your CPU and peripheral areas cool. Broad socket compatibility makes it suitable for almost all the mainstream motherboard platforms. battery copper sheet, battery copper sheet Suppliers and new product cu foam copper plate heat dissipation material offers 2,686 battery copper sheet products. A wide variety of battery copper sheet options are available to you, such as local service location, processing service, and alloy or not.

marinCool Peltier Effect Refrigeration - Practical Sailor

A copper braid connects a heat sink inside the cooling box to a copper plate attached as a thru-hull fitting to the outside of the hull below the waterline. Next to the copper plate rests an electronic heat pump. As current is applied to the pump, heat is transferred from the cooling box to the sea by way of the copper braid.Catalog No. CU1813 Shape Sheet, belt or customized Material Copper Thickness 0.3-100mm China Heat Dissipation Materials Cu Foam, Copper Foam, for new product cu foam copper plate heat dissipation materialProduct Application 1.Heat diffusion, dissipation and exchange materials for electronic components such as CPU, display card and LED etc. 2.Electrode material for batteries, such as lithium ion battery, fuel cell, nickel-zinc battery, etc. 3.Electromagnetic shielding materials. 4.Catalyst and Cu Foam + Copper Plate, Heat Exchanger, Heat Sink, New Cu Foam + copper plate,heat exchanger,heat sink,new product Cu Foam + copper plate Heat transfer coefficient:>6w/(m2k) Mechanical strength:2.5MPa Tensile strength:5-18KPa Pore size:0.1-10mm Porosity:60-98% Through-hole rate:98 Volume density:>0.15/cm3 PPi(number of pore per inch):5-130 Application Heat dissipation material, heat new product cu foam copper plate heat dissipation material

Price Range $40 Reviews 2 What is thermal conductivity? (article) Khan Academy

The letter represents the amount of heat transferred in a time , is the thermal conductivity constant for the material, is the cross sectional area of the material transferring heat, is the difference in temperature between one side of the material and the other, and is the thickness of the material. These factors can be seen visually in the new product cu foam copper plate heat dissipation materialReviews 50 Out of Plane Thermal Conductivity of Carbon Fiber new product cu foam copper plate heat dissipation materialHighly conductive fillers have a strong influence on improving the poor out of plane thermal conductivity of carbon fiber reinforced composites. The objective of this study has been to investigate the role of the diamond powder (DP) in enhancing the out-of-plane thermal conductivity of the woven composites. Samples of the standard modulus T300 carbon fiber composite with 44% and 55%

Seller Rating 99.9% positive Location Nanking, China Shipping Free Cables, Connectors, Enclosures,EMI shielding - All new product cu foam copper plate heat dissipation material

Features A new 2 in 1 shielding film for shielding and heat dissipation. Copper foil as base material, it has excellent EMI shielding and heat dissipation effects.

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